Monday, January 24, 2011

IBM and ARM partner on next-gen mobile chips

WorldWideTech & Science. Francisco De Jesús.


Software giant IBM and UK chip designer ARM have joined forces to develop “advanced semiconductor technology” for mobile devices.


 The partnership will focus on developing 14nm chips that use less power but can support “uninterrupted Internet access, high end multimedia and secure transactions.”


IBM and ARM will collaboratively develop design platforms aligning the manufacturing process, microprocessor and physical IP design teams, the two firms said in a statement.


 They claim the collaboration “will minimise the risk and barriers to migrating to smaller geometries while enabling optimised density, performance, power and yield in advanced SoC [System-on-chip] designs,” which will serve to “accelerate the introduction of advanced electronics into the marketplace.”


“ARM’s Cortex processors have become the leadership platform for the majority of smartphones and many other emerging mobile devices,” said Michael Cadigan, general manager, IBM Microelectronics. 


“We plan to continue working closely with ARM and our foundry customers to speed the momentum of ARM technology by delivering highly advanced, low-power semiconductor technology for a variety of new communications and computing devices.”


Last week’s announcement builds on a relationship between the two firms which has been in place since 2008.

Due to previous collaboration on 32nm and 28nm designs, ARM says it has already delivered eleven test chips that provide “concrete research structures and early silicon validation.”

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